• Perform mechanical/thermal modeling and characterization in development of 3D package with through silicon via (TSV), embedded module packages or MEMS packages, mainly on stress/warapge analysis, heat transfer and liquid flow modeling, packaging process and multi-physics modeling, thermal cycling and drop/impact simulation – life prediction.
• Plan and perform material characterization and useful experiments for model development and validation

Requirements:

• PhD in Mechanical Engineering with 3 to 5 years of relevant experience.
• Mechanical modeling and characterization experience in microelectronics, heat transfer and cooling solution, assembly/packaging field.
• Strong background and proven track record in carrying out research and development in packaging development
• Excellent analytical, communication & presentation skills.
• High energy & teamwork.

Application Info:
Our Rewards
As we believe in recruiting only the best, we offer successful candidates premier remuneration package and attractive benefits plans which include Annual Wage Supplement, Performance Bonuses, Medical & Life Insurance Plans and Relocation Benefits

We invite you to apply with your full resume, including current and expected salaries, relevant experience and contact number(s).